- Skill ID
- aklofas/kicad-happy/emc
- Publisher
- aklofas
- Repository
- kicad-happy
- Installs
- 0
- Files
- 9
- Synced
- Sep 23, 2026
Open any RiverX project, open the Skills panel in the chat, and search for this identifier. The files are fetched from the source repository at install time.
aklofas/kicad-happy/emcInstalls these files- SKILL.md
- references/emc-methodology.md
- references/emc-standards.md
- references/pcb-emc-rules.md
- scripts/analyze_emc.py
- scripts/emc_envelope.py
- scripts/emc_formulas.py
- scripts/emc_rules.py
- scripts/emc_spice.py
What this skill tells the agent
EMC Pre-Compliance Skill
Automated EMC risk analysis for KiCad PCB designs. Identifies the most common causes of EMC test failures using geometric rule checks, analytical emission formulas, and optional SPICE simulation.
This is a risk analyzer, not a compliance predictor. It catches ~70% of common EMC design mistakes before fabrication. It cannot guarantee FCC/CISPR compliance — only a calibrated measurement in an accredited lab can do that. But it can reduce the first-spin failure rate from ~50% toward ~20-30%, potentially saving $5K-$50K per avoided board respin.
Related Skills
| Skill | Purpose |
|---|---|
kicad | Schematic/PCB analysis — produces the analyzer JSON this skill consumes |
kicad (thermal) | Thermal hotspot analysis — MLCC derating and ferrite/inductor overheating findings can amplify EMC decoupling and filter issues (an over-stressed MLCC degrades; a hot ferrite drifts impedance). Worth cross-checking when EMC flags DC-001/DC-002 or EF-001/EF-002. |
spice | SPICE simulation — provides simulator backend for SPICE-enhanced PDN/filter checks |
Handoff guidance: Run the kicad skill's analyze_schematic.py and analyze_pcb.py first — this skill consumes their JSON output. Use --full on the PCB analyzer for best results (enables per-track coordinates for ground plane crossing, edge proximity, and return path checks). During a design review, run EMC analysis after the schematic/PCB analyzers, SPICE simulation, and thermal analysis, then incorporate EMC findings into the report.
Requirements
- Python 3.10+ — stdlib only, no pip dependencies
- Schematic analyzer JSON — from
analyze_schematic.py --output - PCB analyzer JSON — from
analyze_pcb.py --full --output(recommended with--full) - SPICE simulator (optional) — ngspice, LTspice, or Xyce for SPICE-enhanced PDN/filter checks. Auto-detected. Without one, analytical models run unchanged.
Workflow
Step 1: Run the analyzers
python3 <kicad-skill-path>/scripts/analyze_schematic.py design.kicad_sch --analysis-dir analysis/
python3 <kicad-skill-path>/scripts/analyze_pcb.py design.kicad_pcb --full --analysis-dir analysis/Step 2: Run EMC analysis
Pass --analysis-dir analysis/ — the script auto-resolves schematic.json and pcb.json from the manifest's current run, and writes emc.json into the same folder so the manifest tracks it.
# Recommended: auto-resolve inputs from the current run
python3 <skill-path>/scripts/analyze_emc.py --analysis-dir analysis/
# Equivalent — explicit paths still accepted (and required if you want to
# point at a non-current run or override one input)
python3 <skill-path>/scripts/analyze_emc.py \
--schematic analysis/<run_id>/schematic.json \
--pcb analysis/<run_id>/pcb.json \
--analysis-dir analysis/
# One-off JSON (bypasses the cache)
python3 <skill-path>/scripts/analyze_emc.py --schematic schematic.json --pcb pcb.json --output emc.json
# SPICE-enhanced (improved PDN and filter accuracy)
python3 <skill-path>/scripts/analyze_emc.py --analysis-dir analysis/ --spice-enhanced
# Select target standard
python3 <skill-path>/scripts/analyze_emc.py --analysis-dir analysis/ --standard cispr-class-b
# Select target market (sets all applicable standards)
python3 <skill-path>/scripts/analyze_emc.py --analysis-dir analysis/ --market eu
# Filter by severity
python3 <skill-path>/scripts/analyze_emc.py --analysis-dir analysis/ --severity high
# Human-readable text output
python3 <skill-path>/scripts/analyze_emc.py --analysis-dir analysis/ --textStep 3: Interpret results
Read the JSON report and incorporate findings into the design review. Each finding has a severity, rule ID, description, and actionable recommendation. See "Interpreting Results" below.
What Gets Checked
44 rule IDs across 18 categories. Each rule has a specific threshold, rationale, and source citation — see references/pcb-emc-rules.md for full details.
| Category | Rules | What it detects |
|---|---|---|
| Ground plane | GP-001 to GP-005 | Signal crossing voids, zone fragmentation, missing ground planes, low fill ratio, multiple ground domains |
| Decoupling | DC-001 to DC-003 | Cap too far from IC, IC with no decoupling cap, cap too far from via |
| I/O filtering | IO-001, IO-002 | Connector without filtering, insufficient ground pins |
| Switching EMC | SW-001 to SW-003 | Harmonic overlap, switching node copper area, input cap loop area |
| Clock routing | CK-001 to CK-003 | Clock on outer layer, long trace, clock near connector |
| Via stitching | VS-001 | Ground via spacing exceeds λ/20 at highest frequency |
| Stackup | SU-001 to SU-003 | Adjacent signal layers, signal far from reference plane, thin interplane capacitance |
| Diff pair | DP-001 to DP-004 | Intra-pair skew vs protocol limits, CM radiation, reference plane change, outer layer routing |
| Board edge | BE-001 to BE-003 | Signal near edge, incomplete ground pour ring, connector area stitching |
| PDN impedance | PD-001 to PD-004 | Anti-resonance peaks, distributed rail impedance at IC load points, cross-rail coupling from downstream switching regulators |
| Return path | RP-001 | Layer transition via without nearby ground stitching via |
| Crosstalk | XT-001 | 3H spacing violation, aggressor-victim pairs |
| EMI filter | EF-001, EF-002 | Filter cutoff too close to switching frequency (analytical or SPICE insertion loss) |
| ESD path | ES-001, ES-002 | TVS too far from connector, insufficient ground vias near TVS |
| Thermal-EMC | TH-001, TH-002 | MLCC DC bias derating (SRF shift), ferrite near heat source |
| Shielding | SH-001 | Connector aperture slot resonance near emission source |
| Emission estimates | EE-001, EE-002 | Board cavity resonance, switching harmonic envelope |
Advisory outputs (not findings):
- Pre-compliance test plan — frequency band prioritization, interface risk ranking, near-field probe points
- Regulatory coverage — market-to-standards mapping, coverage matrix (what the tool checks vs what requires lab testing)
Output Format
{
"summary": {
"total_checks": 42,
"critical": 2, "high": 5, "medium": 8, "low": 12, "info": 15,
"emc_risk_score": 73
},
"target_standard": "fcc-class-b",
"findings": [
{
"category": "ground_plane",
"severity": "CRITICAL",
"rule_id": "GP-001",
"title": "Signal crosses ground plane void",
"description": "Net SPI_CLK crosses a 3.2mm gap in GND on In1.Cu",
"components": ["U3", "U7"],
"nets": ["SPI_CLK"],
"recommendation": "Route around the gap, or fill the void"
}
],
"per_net_scores": [
{"net": "SPI_CLK", "score": 67, "finding_count": 3, "rules": ["GP-001", "CK-001", "BE-001"]}
],
"test_plan": {
"frequency_bands": [{"band": "30-88 MHz", "risk_level": "high", "source_count": 12}],
"interface_risks": [{"connector": "J1", "protocol": "USB", "risk_score": 8}],
"probe_points": [{"ref": "L1", "x": 45.2, "y": 32.1, "reason": "switching inductor"}]
},
"regulatory_coverage": {
"market": "us",
"applicable_standards": ["FCC Part 15 Class B"],
"coverage_matrix": [{"standard": "...", "coverage": "partial", "note": "..."}]
}
}Severity Levels
| Severity | Meaning | Action |
|---|---|---|
| CRITICAL | Almost certain to cause EMC failure | Must fix before fabrication |
| HIGH | Very likely to cause issues | Strongly recommend fixing |
| MEDIUM | May cause issues depending on specifics | Review and assess |
| LOW | Minor risk, good practice | Fix if convenient |
| INFO | Informational — frequencies, estimates | Useful for lab prep |
Risk Score
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Open any RiverX project, search the Skills panel for aklofas/kicad-happy/emc, and install it in one click.
